Kinetic Technologies Selects Dongbu HiTek to Manufacture LED Driver ICs Destined for Smart Phone Applications | 2014-05-27 |
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... Korean foundry has begun volume production using its groundbreaking low-voltage BCDMOS process at the 0.18-micron node
SEOUL, KOREA – May 27, 2014
“Our BD180LV process continues to set the high-performance standard for advanced mixed-signal technologies that promise to shrink the size of chips for handheld consumer products,” said Jae Song, Dongbu HiTek EVP of marketing. He noted that Dongbu HiTek is leveraging its specialized BCDMOS to implement an expanding range of power management chips such as the LED Driver IC, input protection switches and DC/DC converters for Kinetic. “We look forward to extending our foundry partnership with Kinetic into manufacturing power management chips for AMOLED displays and buck converters as well as other applications.”
Dongbu HiTek’s BD180LV process was formally launched about four years ago at the International Symposium on Power Semiconductor Devices in Hiroshima, Japan. In a technical paper presented at that time, the company disclosed impressive BD180LV breakdown characteristics for 24V nLDMOS, noting, “The Ids-Vds curve shows very stable characteristics up to 27.5V with actual off-state and on-state breakdown voltages of 36V and 33V, respectively. At 5.0Vgs and 0.1Vds, the Rsp was 0.0145 ohms square millimeter – the lowest ever reported in the semiconductor industry.” Since then, the Korean foundry has consistently improved its BD180LV process to maintain its best-in-class achievement.