DB HiTek’s two world class wafer fabrication facilities produce state-of-the-art ICs across the 90㎚ to 0.35㎛ range of processing nodes.

Fab1 in Bucheon-si (Gyeonggi-do) and Fab2 in Eumseong-gun (Chungcheongbuk-do) are located 45 and 150 kilometers, respectively, from Incheon International Airport. Most of Korea’s semiconductor device and equipment companies are located less than 100 kilometers from Fab1 and 2. Accordingly, DB HiTek’s fabs are strategically centered in Korea’s vibrant semiconductor infrastructure.

Fab1 produces state-of-the-art chip solutions across 0.15-to 0.35-micron processing nodes. Such solutions include Analog, power and Mixed-signal chips.

Fab2 produces cutting-edge chip solutions across 90-nanometer to 0.18-micron processing nodes. Such solutions include CMOS Image Sensor(CIS), mixed-signal, etc.